UNIVERSITAS BINA DARMA - PASCA SARJANA - TEKNIK SIPIL - KOMPUTER &SIMULASI (MTS271202) - Introduction of SLOPE/W, SEEP/W, and SIGMA/W

UNIVERSITAS BINA DARMA, UNIVERSITAS BINA DARMA UNIVERSITAS BINA DARMA - PASCA SARJANA - TEKNIK SIPIL - KOMPUTER &SIMULASI (MTS271202) - Introduction of SLOPE/W, SEEP/W, and SIGMA/W. UNIVERSITAS BINA DARMA.

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3. Komputer dan Simulasi-Part 1(14Dec19)rev1 PASCA SARJANA 2020 - 2021 GANJIL UBD.pdf
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Abstract

The GeoStudio 2012 suite includes eight products: • SLOPE/W – A software for computing the factor of safety of earth and rock slopes based on limit equilibrium method. • SEEP/W – A finite element software for analyzing groundwater seepage and excess pore�water pressure dissipation problems within porous materials such as soil and rock. • SIGMA/W – A finite element software that can be used to perform stress and deformation analyses of earth structures. • QUAKE/W – A finite element software for the dynamic analysis of earth structures subjected to earthquake shaking, or point dynamic forces from a blast or a sudden impact load. • TEMP/W – A finite element software for analyzing thermal changes in the ground due to environmental factors or the construction of facilities such as buildings or pipelines. • CTRANS/W – A finite element software that can be used to model the movement of contaminants through porous materials such as soil and rock. • AIR/W – A finite element software for analyzing groundwater-air interaction problems within porous materials such as soil and rock. • VADOSE/W – VADOSE/W is a finite element CAD software product for analyzing flow from the environment, across the ground surface, through the unsaturated vadose zone and into the local groundwater regime.

Item Type: Other
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Engineering, Science and Mathematics > School of Civil Engineering and the Environment
Depositing User: Mr Edi Surya Negara
Date Deposited: 17 Feb 2022 05:14
Last Modified: 17 Feb 2022 05:14
URI: http://eprints.binadarma.ac.id/id/eprint/5830

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